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MMDF3N02HD
Power MOSFET
3 Amps, 20 Volts
N ? Channel SO ? 8, Dual
These miniature surface mount MOSFETs feature ultra low R DS(on)
and true logic level performance. They are capable of withstanding
high energy in the avalanche and commutation modes and the
drain ? to ? source diode has a very low reverse recovery time. These
devices are designed for use in low voltage, high speed switching
applications where power efficiency is important. Typical applications
are dc ? dc converters, and power management in portable and battery
powered products such as computers, printers, cellular and cordless
phones. They can also be used for low voltage motor controls in mass
storage products such as disk drives and tape drives. The avalanche
energy is specified to eliminate the guesswork in designs where
inductive loads are switched and offer additional safety margin against
unexpected voltage transients.
Features
http://onsemi.com
3 AMPERES, 20 VOLTS
R DS(on) = 90 m W
N ? Channel
D
G
?
?
?
?
?
?
?
?
?
Ultra Low R DS(on) Provides Higher Efficiency and Extends Battery Life
Logic Level Gate Drive ? Can Be Driven by Logic ICs
Miniature SO ? 8 Surface Mount Package ? Saves Board Space
Diode Is Characterized for Use In Bridge Circuits
Diode Exhibits High Speed, With Soft Recovery
I DSS Specified at Elevated Temperature
Avalanche Energy Specified
Mounting Information for SO ? 8 Package Provided
This is a Pb ? Free Device
8
1
D3N02
A
S
MARKING
DIAGRAM
8
SO ? 8, DUAL D3N02
CASE 751 AYWW G
STYLE 11 G
1
= Device Code
= Assembly Location
MAXIMUM RATINGS (T J = 25 ° C unless otherwise noted)
Rating Symbol
Value
Unit
Y
WW
G
= Year
= Work Week
= Pb ? Free Package
Drain ? to ? Source Voltage
Drain ? to ? Gate Voltage (R GS = 1.0 M W )
Gate ? to ? Source Voltage ? Continuous
V DSS
V DGR
V GS
20
20
± 20
Vdc
Vdc
Vdc
(Note: Microdot may be in either location)
PIN ASSIGNMENT
Drain Current ? Continuous @ T A = 25 ° C
Drain Current ? Continuous @ T A = 100 ° C
Drain Current ? Single Pulse (t p ≤ 10 m s)
Total Power Dissipation @ T A = 25 ° C (Note 1)
Operating and Storage Temperature Range
I D
I D
I DM
P D
T J , T stg
3.8
2.6
19
2.0
? 55 to 150
Adc
Apk
W
° C
Source ? 1
Gate ? 1
Source ? 2
Gate ? 2
1
2
3
4
8
7
6
5
Drain ? 1
Drain ? 1
Drain ? 2
Drain ? 2
Single Pulse Drain ? to ? Source Avalanche
Energy ? Starting T J = 25 ° C (V DD = 20 Vdc,
V GS = 5.0 Vdc, Peak I L = 9.0 Apk,
L = 10 mH, R G = 25 W )
Thermal Resistance, Junction ? to ? Ambient
(Note 1)
E AS
R q JA
405
62.5
mJ
° C/W
ORDERING INFORMATION
Device Package Shipping ?
MMDF3N02HDR2G SO ? 8 2500 Tape & Reel
Maximum Lead Temperature for Soldering T L 260 ° C
Purposes, 1/8 ″ from case for 10 seconds
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Mounted on 2 ″ square FR4 board (1 ″ sq. 2 oz. Cu 0.06 ″ thick single sided) with
one die operating, 10 sec. max.
(Pb ? Free)
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
? Semiconductor Components Industries, LLC, 2011
October, 2011 ? Rev. 8
1
Publication Order Number:
MMDF3N02HD/D
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